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    AM OLED Metal Mask Cleaner (Open Mask) – Dipping Type
  • Features
  • · Dimension : 41,370 * 12,000 * 4,000
  • · Mode : Full Auto
  • · Control : PLC + PC
  • Specification
  • · Chemical: TWN-200, AGMG, IPA New Concept(非危険物、非危険性)
    CS-700MC, CS701AC, CS-3100E
  • · Temp: 30 ~ 60℃
  • · 入出庫管理システム、自動検査機、乾燥機含む
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    AM OLED Metal Mask Cleaner (Open Mask) – In-line Type
  • Features
  • · Dimension: 15,000 * 5,000 * 2,800
  • · Mode: Full Auto
  • · Control: PLC
  • Specification
  • ·Config : Load → B/F#1 → Chemical → B/F#2 → Rinse#1,
    #2 → A/K(HOT) → Oven → Unload
  • · Supply Chemical Solution
  • · Type: In-line Conveyer Movement (Horizontal)
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    Si-Cathode Final Cleaning / Hole & Surface Etching 設備
  • Features
  • · Dimension: 41,370 * 12,000 * 4,000
  • · Mode: Full Auto
  • · Control: PLC + PC
  • Specification
  • · Config.: Load → Acid#1 → Rinse#1 →Acid#2
    → Rinse#2, #3 → Hot DIW →IR Oven Dry
    → Unload (depends on E.Q. process)
  • · Supply Chemical Solution
  • · TR moving / Agitation / Rolling /
    Bubbling / Ultrasonic
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    Square Wet Station 設備
  • Features
  • · Dimension: 1,320 * 1,200 * 2,220
    (depends on Target product size)
  • · Mode: Full Auto
  • · Control: PLC
  • Specification
  • · Config.: Load > Acid > IPA > Dry > Unload
    (depends on User’s process)
  • · Square Rotation / 機器面積の最小化 / LABに最適
  • · TR moving / Agitation / Ultrasonic / CE 認証
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    Wafer Cleaning Equipment
  • Features
  • · Mode: Full Auto Half Auto / Manual Mode
  • · Touch Screen Operation
  • · Real time display of system condition
  • · Certification: CE
  • Specification
  • · Chemical: HF, HNO3, NH4OH, H3PO4, BOE
  • · Bath Material: PTFE
  • · Chemical Mixing
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    Single Wafer Spin Etching & Cleaner (300mm)
  • Process Recipe
  • · H2SO4 PR Strip
  • · HF/BOE Etching Process
  • · Organic Strip Process
  • · CH3COOH+HF Etching
  • · SC-1 Clean Process
  • · DIW Rinse & Spin Dryer
  • Features
  • · 2 ~ 8 Heads System
  • · Chemical Etching & Clean Process
  • · Touch Screen Operation
  • · Real time display of system condition
  • Specification
  • · Chemical Mixing Features
  • · Uniformity: ≤ ±1%
  • · Spin : Servo Motor ≥ 3000rpm
  • · Chemical & DIW Nozzle
  • · X,Y,Z-Axis Transfer
  • · Transfer Robot Install
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    Quartz & Si Tube Cleaning Equipment
  • Features
  • · Mode: Auto mode
  • · Half Auto mode
  • · Touch Screen Operation
  • · Real time display of system condition
  • · S-Mark [KOSHA]
    SEMI-S2 [SGS]
  • Specification
  • · Tube Size: for 300㎜ Wafer
  • · Chemical: HF, HNO3
  • · Bath Material: PVDF
  • · Auto Bath Cover
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    防着プレート Cleaning Equipment
  • Features
  • · Dimension 15,000*3,000*4,300(H)
  • · Mode: Manual Mode
  • · Temp Control
  • · 超音波
  • Specification
  • · Chemical: RE-01, TWN100
  • · Bath Material: SUS316
  • · Temp: 30~60℃
  • · Transfer Robot
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    Chemical Delivery System
  • Features
  • · Mode: Auto & Half Auto mode
  • · Touch Screen Operation
  • · Real time display of system condition
  • · S-Mark [KOSHA]
  • Specification
  • · SC-1 Mixing Supply System
  • · Developer Mixing Supply System
  • · Organic Chemical Supply System

CSPのWET設備一覧です。