- · E/R : 400~500A/min(at 30 ℃ )
- · Under-cut : Under 1um (150% over etch)
- · Materials : Al, Cu damage free
- Semiconductor Etching Solution
- TiW Etchant
- Cleaning Parts (Non-metal)
- Sealant Cleaning Solution
- · Application : LCD process syringe / bracket / nozzle
- · Improved cleaning power in comparison to Acetone
- · Materials : SUS, PE, PP, PTFE damage free
- Cleaning Parts (Metal)
- AI/Plasma Burn Cleaning Solution
- · Application : Semi-conductor ceramic parts
- · Materials : SUS,Ceramic, PVC, PE, PP, PTFE damage free
- Solder remover
- For Solder remover wafer
- · E/R : 12~15um/min(at 40℃)
- For Solder remover DRAM
- · E/R : 5~7um/min(at 25℃)
- · IMC damage free(Not Cu protection)
- Invar Mask Total solution
| Division | Purpose | Name | Note |
| Mask production | Sliming&Patterning | CS-313IA | |
| Laser Pattern Cleaning | CS-302MC, CS-303MC | ||
| PR Cleaning | CS-550 | ||
| organic vapor deposition&Initial cleaning | organic vapor deposition&Fluorescent Residue | NMP&CS-700T | |
| Processed oil and Jinhae cleaning | CS-701AC | ||
| inorganic deposition network | inorganic cleaning (AgMg) | CS-100SE | |
| weapon cleaning (LiF) | CS-701AC |
MASK production by process
- · Sliming & Patterning
CS-313A - · Laser Pattern Cleaning
CS-302MC, 303MC - · PR Cleaning
CS-550
2. Organic deposition film & initial cleaning by process
- · Organic Vapor Deposition & Fluorescent Residue
NMP & CS-700T - · Processing oil and electrolytic cleaning
CS-701AC
3. Inorganic deposition film cleaning
- · inorganic cleaning
(AgMg)
CS-100SE - · inorganic cleaning
(LiF)
CS-701AC
You can view the entire CSP WET equipments.
