- · Dimension : 41,370 * 12,000 * 4,000
- · Mode : Full Auto
- · Control : PLC + PC
- AM OLED Metal Mask Cleaner (Open Mask) – Dipping Type
- Features
- Specification
- · Chemical: TWN-200, AGMG, IPA New Concept(비 위험물, 비 위험성)
CS-700MC, CS701AC, CS-3100E - · Temp: 30 ~ 60℃
- · 입/출고 System, 자동검사기, 건조기 포함
- AM OLED Metal Mask Cleaner (Open Mask) – In-line Type
- Features
- · Dimension: 15,000 * 5,000 * 2,800
- · Mode: Full Auto
- · Control: PLC
- Specification
- ·Config : Load → B/F#1 → Chemical → B/F#2 → Rinse#1,
#2 → A/K(HOT) → Oven → Unload - · Supply Chemical Solution
- · Type: In-line Conveyer Movement (Horizontal)
- Si-Cathode Final Cleaning / Hole & Surface Etching 설비
- Features
- · Dimension: 41,370 * 12,000 * 4,000
- · Mode: Full Auto
- · Control: PLC + PC
- Specification
- · Config.: Load → Acid#1 → Rinse#1 →Acid#2
→ Rinse#2, #3 → Hot DIW →IR Oven Dry
→ Unload (depends on E.Q. process) - · Supply Chemical Solution
- · TR moving / Agitation / Rolling /
Bubbling / Ultrasonic
- Square Wet Station 설비
- Features
- · Dimension: 1,320 * 1,200 * 2,220
(depends on Target product size) - · Mode: Full Auto
- · Control: PLC
- Specification
- · Config.: Load > Acid > IPA > Dry > Unload
(depends on User’s process) - · Square Rotation / 장비 면적 최소화 / LAB용으로 적합
- · TR moving / Agitation / Ultrasonic / CE 인증
- Wafer Cleaning Equipment
- Features
- · Mode: Full Auto Half Auto / Manual Mode
- · Touch Screen Operation
- · Real time display of system condition
- · Certification: CE
- Specification
- · Chemical: HF, HNO3, NH4OH, H3PO4, BOE
- · Bath Material: PTFE
- · Chemical Mixing
- Single Wafer Spin Etching & Cleaner (300mm)
- Process Recipe
- · H2SO4 PR Strip
- · HF/BOE Etching Process
- · Organic Strip Process
- · CH3COOH+HF Etching
- · SC-1 Clean Process
- · DIW Rinse & Spin Dryer
- Features
- · 2 ~ 8 Heads System
- · Chemical Etching & Clean Process
- · Touch Screen Operation
- · Real time display of system condition
- Specification
- · Chemical Mixing Features
- · Uniformity: ≤ ±1%
- · Spin : Servo Motor ≥ 3000rpm
- · Chemical & DIW Nozzle
- · X,Y,Z-Axis Transfer
- · Transfer Robot Install
- Quartz & Si Tube Cleaning Equipment
- Features
- · Mode: Auto mode
- · Half Auto mode
- · Touch Screen Operation
- · Real time display of system condition
- · S-Mark [KOSHA]
SEMI-S2 [SGS]
- Specification
- · Tube Size: for 300㎜ Wafer
- · Chemical: HF, HNO3
- · Bath Material: PVDF
- · Auto Bath Cover
- 방착판 Cleaning Equipment
- Features
- · Dimension 15,000*3,000*4,300(H)
- · Mode: Manual Mode
- · Temp Control
- · 초음파
- Specification
- · Chemical: RE-01, TWN100
- · Bath Material: SUS316
- · Temp: 30~60℃
- · Transfer Robot
- Chemical Delivery System
- Features
- · Mode: Auto & Half Auto mode
- · Touch Screen Operation
- · Real time display of system condition
- · S-Mark [KOSHA]
- Specification
- · SC-1 Mixing Supply System
- · Developer Mixing Supply System
- · Organic Chemical Supply System